| Datasheet |
 |
PM8324-FEI |
Microsemi Corporation |
TEMAP 84FDL GREEN DUAL PASSIVATI |
| Datasheet |
|
VSC7468YIH-02 |
Microsemi Corporation |
24X1G + 4X10G OR 48X1G + 2X10G ( |
| Datasheet |
|
PM8324-FGI |
Microsemi Corporation |
84/63 CHAN T1/E1 VT1.5/VT2 MAPPE |
| Datasheet |
|
ZL50073GAG2 |
Microsemi Corporation |
IC DIGITAL SWITCH 32K CH 484BGA |
| Datasheet |
 |
DS34S132GNA2+ |
Chip Inventory |
IC TDM PACKET 32PORT 676PBGA |
| - |
|
PM8321-PGI |
Microsemi Corporation |
HIGH DENSITY FRAMER/MAPPER FOR 8 |
| Datasheet |
|
PM4390-FEI |
Microsemi Corporation |
ARROW M8XFE |
| Datasheet |
|
ZL50112GAG2 |
Microsemi Corporation |
IC CESOP PROCESSOR 552BGA |
| Datasheet |
|
XRT75R12IB |
Exar Corporation |
IC LIU E3/DS3/STS-1 12CH 420TBGA |
| Datasheet |
|
XRT75R12IB-L |
Exar Corporation |
IC LIU E3/DS3/STS-1 12CH 420TBGA |
| Datasheet |
|
ZL38070GBG2 |
Microsemi Corporation |
IC VOICE ECHO CANCEL 535MCMBGA |
| Datasheet |
|
VSC8494YJE-13 |
Microsemi Corporation |
DUAL/QUAD 10GBE UNIV PHY W/OTN-F |
| Datasheet |
|
MT93L04AG2 |
Microsemi Corporation |
IC VOICE ECHO CANCEL 365MCMBGA |
| Datasheet |
|
PM8324-FXI |
Microsemi Corporation |
TEMAP 84FDL, LF BUMP |
| - |
|
PM5329-FEI |
Microsemi Corporation |
ARROW 24XFE PB FREE |
| - |
|
PM8318-FXI |
Microsemi Corporation |
TEMAP 168, LF BUMP |
| - |
|
PM7381-PGI |
Microsemi Corporation |
32 LINK, 672 HDLC CHANNEL FRAME |
| - |
|
PM8321-PI |
Microsemi Corporation |
HIGH DENSITY FRAMER/MAPPER FOR 8 |
| - |
|
PM7381-PI |
Microsemi Corporation |
33 LINK, 672 HDLC CHANNEL FRAME |
| Datasheet |
|
ZL50111GAG2 |
Microsemi Corporation |
IC CESOP PROC 1024CH 552BGA |
| Datasheet |
|
PM5397-FEI |
Microsemi Corporation |
ARROW 2XGE PB FREE |
| Datasheet |
|
PM5397-FGI |
Microsemi Corporation |
ARROW 2XGE PB FREE |
| - |
|
PM5397H-FXI |
Microsemi Corporation |
ARROW 2XGE |
| Datasheet |
|
PM8316-PGI |
Microsemi Corporation |
84/63 CHANNEL T1/E1 FRAMER DEVIC |
| Datasheet |
|
PM8320-PGI |
Microsemi Corporation |
TEMUX-84 WITH E3 MAPPERS, DS3/E3 |
| Datasheet |
|
PM8316-PI |
Microsemi Corporation |
84/63 CHANNEL T1/E1 FRAMER DEVIC |
| - |
|
PM5336B-FGI |
Microsemi Corporation |
HIGH CAPACITY SINGLE-CHIP ADD/DR |
| Datasheet |
|
PM8320-PI |
Microsemi Corporation |
TEMUX-84 WITH E3 MAPPERS, DS3/E3 |
| - |
|
PM5336B-FEI |
Microsemi Corporation |
ARROW 2488, PB FREE |
| - |
|
PM5329-FXI |
Microsemi Corporation |
ARROW 24XFE |
| - |
|
PM5336B-FXI |
Microsemi Corporation |
ARROW 2488, PB FREE |
| Datasheet |
|
PM8311A-FEI |
Microsemi Corporation |
TEMUX 168 PB FREE |
| - |
|
PM5308-FEI |
Microsemi Corporation |
TSE-120 (PB FREE) |
| - |
|
PM5308-FGI |
Microsemi Corporation |
74-PORT (185G) STS-1 CROSS-CONNE |
| Datasheet |
|
PM5324-FEI |
Microsemi Corporation |
PM5324: ARROW-1X192 |
| Datasheet |
|
PM5324-FGI |
Microsemi Corporation |
SONET/SDH TRANSPORT FRAMER/AGGRE |
| - |
|
XRT83L30ES |
Exar Corporation |
IC LIU LH/SH T1/E1 SGL 64TQFP |
| - |
|
XRT83SL30ES |
Exar Corporation |
IC LIU LH/SH T1/E1 SGL 64TQFP |
| - |
|
PM5308-FXI |
Microsemi Corporation |
TSE-120 |
| Datasheet |
|
PM5377-FEI |
Microsemi Corporation |
TSE-240 (PB FREE) |
| Datasheet |
|
PM5377-FGI |
Microsemi Corporation |
96-PORT (240G) STS-1 CROSS-CONNE |
| - |
|
XRT83VL38ES |
Exar Corporation |
IC LIU SH T1/E1/J1 OCTAL 225BGA |
| - |
|
XRT83VSH28ES |
Exar Corporation |
IC LIU SH E1 OCTAL 225BGA |
| - |
|
XRT83VSH38ES |
Exar Corporation |
IC LIU SH T1/E1/J1 8CH 225BGA |
| Datasheet |
|
PM5389-FGI |
Microsemi Corporation |
20G VT/TU SWITCHING ELEMENT |
| Datasheet |
|
PM5376-FEI |
Microsemi Corporation |
TSE-NX160 |
| Datasheet |
|
PM5376-FGI |
Microsemi Corporation |
PM5376 TSE-NX160 |
| Datasheet |
|
PM5389-FEI |
Microsemi Corporation |
WSE-20 |
| Datasheet |
|
PM8310A-FEI |
Microsemi Corporation |
TEMUX 336NG, PB FREE BUMP |
| - |
|
XRT86VL30ES |
Exar Corporation |
IC FRAMR/LIU T1/E1/J1 QD 128LQFP |
